Michael Lane

Associate Provost for Academic Affairs Engineering Science

Professor Lane received his undergraduate degree from Emory & Henry College (’95 majors: Chemistry and Physics) and his Masters of Science and Ph.D. from Stanford University (’00, Materials Science & Engineering).

He joined IBM’s TJ Watson Research Center as a research staff member in the Materials and Reliability Sciences group in December 1999.

Professor Lane later managed the group before leaving IBM in 2007 to join the Chemistry Department at Emory & Henry. Professor Lane holds 40 patents, has published over 50 papers, and has received several recognitions for excellence in teaching.

Many of the students who have worked in his lab have gone on to attend graduate programs at institutions such as Texas A&M, Virginia Tech, Georgia Tech, UC Berkley, University of Kentucky, Notre Dame, Rensselaer Polytechnic Institute, University of Wisconsin, NC State, and Johns Hopkins.


  • Stanford University, Palo Alto, CA
    Ph.D. and M.S., Materials Science & Engineering
  • Emory & Henry College, Emory, VA
    B.S., Chemistry and Physics


Honors and Awards

  • State Council of Higher Education for Virginia Outstanding Faculty Award (2014)
  • Virginia Foundation for Independent Colleges H. Hiter Harris, Jr. Memorial Award for 
    Excellence in Undergraduate Teaching (2012)
  • Exemplary Teaching Award given by The General Board of Higher Education and Ministry of the United Methodist Church (2010)

Student Honors Thesis

  1. Cole, H., “Corrosion micro-mechanisms in meso-porous organo-silicate glass”, 4/2016.
  2. Coulter, T., “Exploring the Use of Aerogels and Zerogels as Optical Vapor Phase Sensors”, 4/2016.
  3. Firebaugh, A., “Modification of silicon-oxygen based thin film surface energy via incorporation of organic moieties”, 5/2013.
  4. Clement, A., “Diffusion in porous SiC:H and SiCO:H thin films”, 5/2013.
  5. Williams, M., “Study on the Efficiency of National Science Foundation Grants given to Liberal Arts Colleges and Research Universities from 2002 to 2011”, 4/2013.
  6. Gallagher, E., “Corrosion of SiC:H and SiCO:H thin films in buffered solutions”, 4/2012.
  7. Zeng, F., “Effect of pH and salt concentration on fracture of organosilicate glass thin films”, 4/2011.


General Chemistry I (CHEM 111)

General Chemistry II (CHEM 112)

Introduction to Inorganic Chemistry (CHEM 230)

This introductory course covers symmetry and group theory, molecular orbitals, and coordination chemistry with an emphasis on the application of group theory.

Materials Science & Engineering (CHEM 320/EGSC 320)

This course covers structure/property relationships of metals, ceramics, and polymers (with an emphasis on metals) in addition to kinetic and thermodynamic relationships. 


(* denotes undergraduate co-author)
  1. Davide G. Sangiovanni, Collin Rowe, Geetu Sharma, Michael Lane, Per Eklund, Ganpati Ramanath; Strain hardening and toughening in metal/molecular nanolayer/metal nanosandwiches. Appl. Phys. Lett. 24 June 2024; 124 (26): 261601. https://doi.org/10.1063/5.0210670
  2. Kwan, M., Braccini, M., Lane, M. W., Ramanath, G.; “Frequency-Tunable Toughening in a Polymer-Metal-Ceramic Stack Using an Interfacial Molecular Nanolayer.” Nature Communications, vol. 9, no. 1, Dec. 2018. Crossref, doi:10.1038/s41467-018-07614-y.
  3. Braccini, M., Kwan, M., Lane, M. W., Ramanath, G.; “Subcritical Crack Growth at Copper/Silica Interface.” Thermec’2018 International Conference on Processing and Manufacturing of Advanced Materials, 2018. HAL Archives Ouvertes, https://hal.archives-ouvertes.fr/hal-01933522.
  4. Kwan, M., Braccini, M., Jain, A., Lane, M. W., Ramanath, G.; “Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface,” Scripta Materialia, 121, 42-44 (2016).
  5. Zeng, F. W.*, Gates, S. M, Lane, M. W.; “Corrosion in low dielectric constant Si-O based thin films: Buffer Concentration Effects,” AIP Advaces 4, 057112 (2014) http://dx.doi.org/10.1063/1.4877665.
  6. Chow, P. K.; Quintero Y. C.; O’Brien, P.; Mutin, P. H.; Lane M. W.; Ramprasad, R.; and Ramanath, G.; “Gold-titania interface toughening and thermal conductance enhancement using an organophosphonate nanolayer;“ Appl. Phys. Lett. 102, 201605 (2013), DOI:10.1063/1.4807436
  7. Hall, A.B.*; Irvine, G.J.*; Gates, S.M.; Lane, M.W.; “Corrosion of Si-O based porous low-k dielectrics”, Applied Physics Letters, 101, 202901 (2012).
  8. Vijayashankar, D.; Zhu, H.; Garg, S.; Teki, R.; Ramprasad, R.; Lane, M.W.; Ramanath, G.; “Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces,” Applied Physics Letters, 99,133103 (2011).
  9. Jain, A.; Singh, B.; Garg, S.; Ravishankar, N.; Lane, M.; Ramanath, G.; “Atomistic fracture energy partitioning at a metal-ceramic interface using a nanomolecular monolayer,” Physical Review B, 83, doi:10.1103/PhysRevB.83.035412 (2011).
  10. Garg, S.; Teki, R.; Lane, M.W.; Ramanath, G.; “Factorial toughening at microcorrugated metal-ceramic interfaces,” Applied Physics Letters, 99,13, 133101 (2011).
  11. Garg, S.; Singh, B.; Teki, R.; Lane, M.W.; Ramanath, G.; “Hydrophobic fluoroalkylsilane nanolayers for inhibiting copper diffusion into silica,” Applied Physics Letters, 96, 143121 (2010).
  12. Garg, S.; Jain, A.; Karthik, C.; Singh, B.; Teki, R.; Smentkowski, VS; Lane, M.W.; Ramanath, G.; “Metal–dielectric interface toughening by molecular nanolayer decomposition,’ Journal of Applied Physics, 108,  034317 (2010).
  13. Singh, A.P.; Gandhi, D.D.; Singh, B.; Simonyi, E.; Liniger, E.G.; Nitta, S.V.; Lane, M.W.; Ramanath, G.; “Pore orientation and silylation effects on mesoporous silica film properties,” Applied Physics Letters, 94, 09350 (2009).
  14. Lane, M.W.; Roush, A.*; Callahan, S.E.*; “Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents,” in the Proceedings of the 10th International Workshop on Stress Induced Phenomenon in Metallization, 1143, 71-86 (2009).
  15. Lane, M.W.; Callahan,S.E.*, Roush, A.*; “Mechanical Scaling Trends and Methods to Improve Reliability of Packaged Interconnect Structures,” in Packaging, Chip-Package Interactions and Solder Materials Challenges, (Mater. Res. Soc. Symp. Proc. Volume 1158E) 1158-F01-01 doi:10.1557/PROC-1158-F01-01 (2009).
  16. Gandhi, D.D.; Singh, B.; Singh, A.P.; Moore, R.; Simonyi, E.; Lane, M.W.; Ramanath, G.; “Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper,” Journal of Applied Physics,106,  054502 (2009).

Extramural Research Funding

  1. Naval Postgraduate School: Effect of Additives on AlNi Intermetallic Properties, 2018, $49500.
  2. Intel Corporation: Diffusion in micro-porous SiCO:H films, 2014, $8000.
  3. Intel Corporation: Diffusion in SiCO:H and SiC:H films, 2013, $12000.
  4. Intel Corporation: Diffusion in SiCO:H and SiC:H films, 2012, $12000.
  5. Collaborative Research: Understanding Mechanical and Thermal Properites and Their Coupling at nanomolecularly Modified Metal-Ceramic Interfaces, awarded by the National Science Foundation 2011-2014, $19529 per year (average)
  6. Crackstop Toughness and Scaling of 3-D Interconnects, awarded by the Semiconductor Research Corporation, 2008-2011, $15,500 per year (average).
  7. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2010-2011, $10000 (renewal).
  8. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2009-2010, $10000 (renewal).
  9. Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents, awarded by the Thomas F. and Kate Miller Jeffress Memorial Trust, 2008-2009, $25000.
  10. Mechanical Scaling Trends in 3-D Interconnects, awarded by the Semiconductor Research Corporation, 2007-2008, $25000.

Contact Info

McGlothin-Street Hall, Room 311
Emory, VA 24327



McGlothlin-Street Hall